Page MenuHomeFreeBSD
Differential D31627

Allow LIO_READV and LIO_WRITEV in lio_listio().
ClosedPublic
Actions

Authored by tmunro on Aug 21 2021, 3:07 AM.
Tags
None
Referenced Files
F115145794: D31627.id93992.diff
Sun, Apr 20, 10:08 PM
Unknown Object (File)
Tue, Apr 8, 3:50 AM
Unknown Object (File)
Sun, Mar 23, 12:16 PM
Unknown Object (File)
Mar 19 2025, 6:06 PM
Unknown Object (File)
Mar 18 2025, 2:39 PM
Unknown Object (File)
Mar 14 2025, 6:48 AM
Unknown Object (File)
Feb 23 2025, 5:28 PM
Unknown Object (File)
Feb 23 2025, 1:09 PM
View All Files
Subscribers
bcr
imp
jhb
kib

Details

Reviewers
asomers
Commits
rG05bfa3e05896: lio_listio(2): Allow LIO_READV and LIO_WRITEV.
rGf30a1ae8d529: lio_listio(2): Allow LIO_READV and LIO_WRITEV.
Summary

Allow multiple vector IOs to be started with one system call. The aio_readv() and aio_writev() functions already used the same code as lio_listio() under the covers. This commit just exposes the formerly internal-only LIO_READV and LIO_WRITEV opcodes to user space.

The new opcode are only visible to user space if __BSD_VISIBLE is defined, being extensions to POSIX, just like the aio_readv() and aio_writev() functions.

The other obvious candidate is LIO_SYNC, but that involves answering some tricky questions about dependencies and is left for later.

I subscribed the reviewers of D27743 (aio_readv() and aio_writev()).

Test Plan

A simple kyua test is included.

Diff Detail

Repository
rG FreeBSD src repository
Lint
Lint Skipped
Unit
Tests Skipped

Event Timeline

tmunro requested review of this revision.Aug 21 2021, 3:07 AM
tmunro created this revision.
tmunro updated this revision to Diff 93992.Aug 21 2021, 3:31 AM

Reuploaded patch with -U99999, no change.

asomers requested changes to this revision.Aug 21 2021, 4:23 AM

Don't forget to bump the date in the man page.

tests/sys/aio/lio_test.c
230

The ftruncate is not necessary, since Kyua will always run the test in a brand-new directory.

This revision now requires changes to proceed.Aug 21 2021, 4:23 AM
tmunro updated this revision to Diff 93993.Aug 21 2021, 4:47 AM
tmunro marked an inline comment as done.
asomers accepted this revision.Aug 21 2021, 1:25 PM
This revision is now accepted and ready to land.Aug 21 2021, 1:25 PM
kib added inline comments.Aug 21 2021, 1:56 PM
lib/libc/sys/lio_listio.2
231

s/FreeeBSD/.Fx/

Closed by commit rGf30a1ae8d529: lio_listio(2): Allow LIO_READV and LIO_WRITEV. (authored by tmunro). · Explain WhyAug 22 2021, 11:05 AM
This revision was automatically updated to reflect the committed changes.
tmunro added a commit: rGf30a1ae8d529: lio_listio(2): Allow LIO_READV and LIO_WRITEV..
tmunro marked an inline comment as done.Aug 22 2021, 11:06 AM
jhb added a commit: rG05bfa3e05896: lio_listio(2): Allow LIO_READV and LIO_WRITEV..Sep 6 2023, 9:57 PM
Herald added a subscriber: imp. · View Herald TranscriptSep 6 2023, 9:57 PM

Revision Contents
Changeset List

PathSize
lib/
libc/
sys/
13 lines
sys/
kern/
4 lines
sys/
4 lines
tests/
sys/
aio/
110 lines
usr.bin/
truss/
2 lines

Diff 93991

View Options

lib/libc/sys/lio_listio.2

Show All 36 Lines
#include <dev/smbus/smbconf.h> #include <dev/smbus/smbconf.h>
#include <dev/smbus/smbus.h> #include <dev/smbus/smbus.h>
#include "smbus_if.h" #include "smbus_if.h"
/* /*
* General device identification notes.
*
* The JEDEC TSE2004av specification defines the device ID that all compliant
* devices should use, but very few do in practice. Maybe that's because
* TSE2002av was rather vague about that.
* Rare examples are IDT TSE2004GB2B0 and Atmel AT30TSE004A, not sure if
* they are TSE2004av compliant by design or by accident.
* Also, the specification mandates that PCI SIG manufacturer IDs are to be
* used, but in practice the JEDEC manufacturer IDs are often used.
*/
rpokalaUnsubmitted
Not Done
Inline Actions

Add a note saying that the spec requires the upper byte of the device_id be 0x22, but that most vendors don't honor that, so that's why we're not checking for it. That makes the 0x22 in the generic case a bit less magic.

rpokala: Add a note saying that the spec requires the upper byte of the device_id be 0x22, but that most…
avgAuthorUnsubmitted
Not Done
Inline Actions

Isn't this comment the comment that you are requesting?

avg: Isn't this comment the comment that you are requesting?
rpokalaUnsubmitted
Not Done
Inline Actions

Err, yes - partly. It mentions that few use the proper one. How about:

... devices should use (high-order byte 0x22), but very few do in practice ...

rpokala: Err, yes - partly. It mentions that few use the proper one. How about: > ... devices should…
avgAuthorUnsubmitted
Not Done
Inline Actions

I think that this comment is fine as is. There is another comment in the code where the magic device ID is actually used.

avg: I think that this comment is fine as is. There is another comment in the code where the magic…
const struct ts_dev {
uint16_t vendor_mask;
impUnsubmitted
Done
Inline Actions

Since the vendor mask is always 0xffff, why have it? It only seems useful for the catch-all at the end...

imp: Since the vendor mask is always 0xffff, why have it? It only seems useful for the catch-all at…
uint16_t vendor_id;
uint16_t device_mask;
impUnsubmitted
Done
Inline Actions

device_mask is likewise always 0xff00. Looks like the lower 8 bits are supposed to be a revision number. I see why you want to mask it, but realistically, will there ever be a time we'd have two different entries here?

imp: device_mask is likewise always 0xff00. Looks like the lower 8 bits are supposed to be a…
rpokalaUnsubmitted
Not Done
Inline Actions

JEDEC Standard No. 21-C
2.24. TSE2004av Device ID / Revision Register
The upper byte of the Device ID / Revision Register must be 0x22 for the TSE2004av. The lower byte holds the revision value which is vendor-specific. This register is not available on EE1004-v devices.

Based on that, we should be looking at all four nybbles, which should be 0x22XX. But as pointed out in the comment, not everyone uses the correct device ID. Since it's the low-order bits which are vendor-specific, shouldn't we only look at those for identification?

(But maybe the vendor datasheets indicate that the low-order bits might be different even for the same part? I haven't looked at them yet; I'll do that later today. If that's the case, then I'd say we shouldn't look at the device-id at all.)

rpokala: > JEDEC Standard No. 21-C > 2.24. TSE2004av Device ID / Revision Register > The upper byte of…
avgAuthorUnsubmitted
Not Done
Inline Actions

The low bits are "volatile". Most vendor specifications say something to the effect that the revision is X in this version of the product and will be incremented in subsequent versions. Anyway, this is mostly moot as of all the devices out there I found only two that have 0x22 in the upper half.

avg: The low bits are "volatile". Most vendor specifications say something to the effect that the…
impUnsubmitted
Not Done
Inline Actions

Right, hence my comment: we should just have a blanket policy of ignoring them and have no need for it in this table.

imp: Right, hence my comment: we should just have a blanket policy of ignoring them and have no need…
avgAuthorUnsubmitted
Not Done
Inline Actions

I removed the generic device ID from the table...
I added it as a special case to ts_match_device though.

avg: I removed the generic device ID from the table... I added it as a special case to…
uint16_t device_id;
const char *description;
} known_devices[] = {
/*
* Analog Devices ADT7408.
* http://www.analog.com/media/en/technical-documentation/data-sheets/ADT7408.pdf
*/
{
0xffff, 0x11d4, 0xff00, 0x0800,
"Analog Devices DIMM temperature sensor"
},
/*
* Atmel AT30TSE002B, AT30TSE004A.
* http://www.atmel.com/images/doc8711.pdf
* http://www.atmel.com/images/atmel-8868-dts-at30tse004a-datasheet.pdf
* Note how one chip uses the JEDEC Manufacturer ID while the other
* uses the PCI SIG one.
*/
{
0xffff, 0x001f, 0xff00, 0x8200,
"Atmel DIMM temperature sensor"
},
{
0xffff, 0x1114, 0xff00, 0x2200,
"Atmel DIMM temperature sensor"
},
/*
* Integrated Device Technology (IDT) TS3000B3A, TSE2002B3C,
* TSE2004GB2B0 chips and their variants.
* http://www.idt.com/sites/default/files/documents/IDT_TSE2002B3C_DST_20100512_120303152056.pdf
* http://www.idt.com/sites/default/files/documents/IDT_TS3000B3A_DST_20101129_120303152013.pdf
* https://www.idt.com/document/dst/tse2004gb2b0-datasheet
*/
{
0xffff, 0x00b3, 0xff00, 0x2900,
"IDT DIMM temperature sensor"
},
{
0xffff, 0x00b3, 0xff00, 0x2200,
"IDT DIMM temperature sensor"
},
/*
* Maxim Integrated MAX6604.
* Different document revisions specify different Device IDs.
* Document 19-3837; Rev 0; 10/05 has 0x3e00 while
* 19-3837; Rev 3; 10/11 has 0x5400.
* http://datasheets.maximintegrated.com/en/ds/MAX6604.pdf
*/
{
0xffff, 0x004d, 0xff00, 0x3e00,
"Maxim Integrated DIMM temperature sensor"
},
{
0xffff, 0x004d, 0xff00, 0x5400,
"Maxim Integrated DIMM temperature sensor"
},
/*
* Microchip Technology MCP9805, MCP9843, MCP98242, MCP98243
* and their variants.
* http://ww1.microchip.com/downloads/en/DeviceDoc/21977b.pdf
* Microchip Technology EMC1501.
* http://ww1.microchip.com/downloads/en/DeviceDoc/00001605A.pdf
*/
{
0xffff, 0x0054, 0xff00, 0x0000,
"Microchip DIMM temperature sensor"
},
{
0xffff, 0x0054, 0xff00, 0x2000,
"Microchip DIMM temperature sensor"
},
{
0xffff, 0x0054, 0xff00, 0x2100,
"Microchip DIMM temperature sensor"
},
{
0xffff, 0x1055, 0xff00, 0x0800,
"Microchip DIMM temperature sensor"
},
/*
* NXP Semiconductors SE97 and SE98.
* http://www.nxp.com/docs/en/data-sheet/SE97B.pdf
*/
{
0xffff, 0x1131, 0xff00, 0xa100,
"NXP DIMM temperature sensor"
},
{
0xffff, 0x1131, 0xff00, 0xa200,
"NXP DIMM temperature sensor"
},
/*
* ON Semiconductor CAT34TS02 revisions B and C, CAT6095 and compatible.
* https://www.onsemi.com/pub/Collateral/CAT34TS02-D.PDF
* http://www.onsemi.com/pub/Collateral/CAT6095-D.PDF
*/
{
0xffff, 0x1b09, 0xff00, 0x0800,
"ON Semiconductor DIMM temperature sensor"
},
{
0xffff, 0x1b09, 0xff00, 0x0a00,
"ON Semiconductor DIMM temperature sensor"
},
/*
* ST[Microelectronics] STTS424E02, STTS2002 and others.
* http://www.st.com/resource/en/datasheet/cd00157558.pdf
* http://www.st.com/resource/en/datasheet/stts2002.pdf
*/
{
0xffff, 0x104a, 0xff00, 0x0000,
"ST DIMM temperature sensor"
},
{
0xffff, 0x104a, 0xff00, 0x0300,
"ST DIMM temperature sensor"
},
/* Generic TSE2004av compliant device. */
{
0x0000, 0x0000, 0xff00, 0x2200,
"TSE2004av compliant DIMM temperature sensor"
},
};
static const struct ts_dev *
ts_match_device(uint16_t vid, uint16_t did)
{
const struct ts_dev *d;
int i;
for (i = 0; i < nitems(known_devices); i++) {
d = &known_devices[i];
if ((vid & d->vendor_mask) == d->vendor_id &&
(did & d->device_mask) == d->device_id) {
return (d);
}
}
return (NULL);
}
/*
* SMBus specification defines little-endian byte order, * SMBus specification defines little-endian byte order,
* but it seems that the JEDEC devices expect it to * but it seems that the JEDEC devices expect it to
* be big-endian. * be big-endian.
*/ */
static int static int
ts_readw_be(device_t dev, uint8_t reg, uint16_t *val) ts_readw_be(device_t dev, uint8_t reg, uint16_t *val)
{ {
device_t bus = device_get_parent(dev); device_t bus = device_get_parent(dev);
Show All 31 Linests_temp_sysctl(SYSCTL_HANDLER_ARGS)
temp = temp * 625 + 2731500; temp = temp * 625 + 2731500;
err = sysctl_handle_int(oidp, &temp, 0, req); err = sysctl_handle_int(oidp, &temp, 0, req);
return (err); return (err);
} }
static int static int
ts_probe(device_t dev) ts_probe(device_t dev)
{ {
device_set_desc(dev, "DIMM memory sensor");
return (BUS_PROBE_DEFAULT); return (BUS_PROBE_DEFAULT);
} }
static int static int
ts_attach(device_t dev) ts_attach(device_t dev)
{ {
struct sysctl_ctx_list *ctx; struct sysctl_ctx_list *ctx;
struct sysctl_oid_list *tree; struct sysctl_oid_list *tree;
const struct ts_dev *match;
int err; int err;
uint16_t vendorid; uint16_t vendorid;
uint16_t devid; uint16_t devid;
uint8_t addr; uint8_t addr;
addr = smbus_get_addr(dev); addr = smbus_get_addr(dev);
if ((addr & 0xf0) != 0x30) { if ((addr & 0xf0) != 0x30) {
/* Up to 8 slave devices starting at 0x30. */ /* Up to 8 slave devices starting at 0x30. */
return (ENXIO); return (ENXIO);
} }
err = ts_readw_be(dev, 6, &vendorid); err = ts_readw_be(dev, 6, &vendorid);
if (err != 0) { if (err != 0) {
device_printf(dev, "failed to read Manufacturer ID\n"); device_printf(dev, "failed to read Manufacturer ID\n");
return (ENXIO); return (ENXIO);
} }
err = ts_readw_be(dev, 7, &devid); err = ts_readw_be(dev, 7, &devid);
if (err != 0) { if (err != 0) {
device_printf(dev, "failed to read Device ID\n"); device_printf(dev, "failed to read Device ID\n");
return (ENXIO); return (ENXIO);
} }
if ((devid & 0xff00) == 0x2200) {
/* match = ts_match_device(vendorid, devid);
* Defined by JEDEC Standard No. 21-C, Release 26, if (match == NULL) {
* Page 4.1.6 – 24
*/
} else if (vendorid == 0x104a) {
/*
* STMicroelectronics datasheets say that
* device ID and revision can vary.
* E.g. STT424E02, Doc ID 13448 Rev 8,
* section 4.6, page 26.
*/
} else if (vendorid == 0xb3 && (devid & 0xff00) == 0x2900) {
/*
* IDT TS3000B3A and TSE2002B3C chips and their variants.
* Revision IDs (the lower byte) can vary.
* http://www.idt.com/sites/default/files/documents/IDT_TSE2002B3C_DST_20100512_120303152056.pdf
* http://www.idt.com/sites/default/files/documents/IDT_TS3000B3A_DST_20101129_120303152013.pdf
*/
} else {
if (bootverbose) { if (bootverbose) {
device_printf(dev, "Unknown Manufacturer and Device IDs" device_printf(dev, "Unknown Manufacturer and Device IDs"
", 0x%x and 0x%x\n", vendorid, devid); ", 0x%x and 0x%x\n", vendorid, devid);
} }
return (ENXIO); return (ENXIO);
} }
device_set_desc(dev, match->description);
ctx = device_get_sysctl_ctx(dev); ctx = device_get_sysctl_ctx(dev);
tree = SYSCTL_CHILDREN(device_get_sysctl_tree(dev)); tree = SYSCTL_CHILDREN(device_get_sysctl_tree(dev));
SYSCTL_ADD_PROC(ctx, tree, OID_AUTO, "temp", SYSCTL_ADD_PROC(ctx, tree, OID_AUTO, "temp",
CTLTYPE_INT | CTLFLAG_RD | CTLFLAG_MPSAFE, dev, 0, CTLTYPE_INT | CTLFLAG_RD | CTLFLAG_MPSAFE, dev, 0,
ts_temp_sysctl, "IK4", "Current temperature"); ts_temp_sysctl, "IK4", "Current temperature");
return (0); return (0);
} }
static int static int
Show All 27 Lines
View Options

sys/kern/vfs_aio.c

Show All 36 Lines
#include <dev/smbus/smbconf.h> #include <dev/smbus/smbconf.h>
#include <dev/smbus/smbus.h> #include <dev/smbus/smbus.h>
#include "smbus_if.h" #include "smbus_if.h"
/* /*
* General device identification notes.
*
* The JEDEC TSE2004av specification defines the device ID that all compliant
* devices should use, but very few do in practice. Maybe that's because
* TSE2002av was rather vague about that.
* Rare examples are IDT TSE2004GB2B0 and Atmel AT30TSE004A, not sure if
* they are TSE2004av compliant by design or by accident.
* Also, the specification mandates that PCI SIG manufacturer IDs are to be
* used, but in practice the JEDEC manufacturer IDs are often used.
*/
rpokalaUnsubmitted
Not Done
Inline Actions

Add a note saying that the spec requires the upper byte of the device_id be 0x22, but that most vendors don't honor that, so that's why we're not checking for it. That makes the 0x22 in the generic case a bit less magic.

rpokala: Add a note saying that the spec requires the upper byte of the device_id be 0x22, but that most…
avgAuthorUnsubmitted
Not Done
Inline Actions

Isn't this comment the comment that you are requesting?

avg: Isn't this comment the comment that you are requesting?
rpokalaUnsubmitted
Not Done
Inline Actions

Err, yes - partly. It mentions that few use the proper one. How about:

... devices should use (high-order byte 0x22), but very few do in practice ...

rpokala: Err, yes - partly. It mentions that few use the proper one. How about: > ... devices should…
avgAuthorUnsubmitted
Not Done
Inline Actions

I think that this comment is fine as is. There is another comment in the code where the magic device ID is actually used.

avg: I think that this comment is fine as is. There is another comment in the code where the magic…
const struct ts_dev {
uint16_t vendor_mask;
impUnsubmitted
Done
Inline Actions

Since the vendor mask is always 0xffff, why have it? It only seems useful for the catch-all at the end...

imp: Since the vendor mask is always 0xffff, why have it? It only seems useful for the catch-all at…
uint16_t vendor_id;
uint16_t device_mask;
impUnsubmitted
Done
Inline Actions

device_mask is likewise always 0xff00. Looks like the lower 8 bits are supposed to be a revision number. I see why you want to mask it, but realistically, will there ever be a time we'd have two different entries here?

imp: device_mask is likewise always 0xff00. Looks like the lower 8 bits are supposed to be a…
rpokalaUnsubmitted
Not Done
Inline Actions

JEDEC Standard No. 21-C
2.24. TSE2004av Device ID / Revision Register
The upper byte of the Device ID / Revision Register must be 0x22 for the TSE2004av. The lower byte holds the revision value which is vendor-specific. This register is not available on EE1004-v devices.

Based on that, we should be looking at all four nybbles, which should be 0x22XX. But as pointed out in the comment, not everyone uses the correct device ID. Since it's the low-order bits which are vendor-specific, shouldn't we only look at those for identification?

(But maybe the vendor datasheets indicate that the low-order bits might be different even for the same part? I haven't looked at them yet; I'll do that later today. If that's the case, then I'd say we shouldn't look at the device-id at all.)

rpokala: > JEDEC Standard No. 21-C > 2.24. TSE2004av Device ID / Revision Register > The upper byte of…
avgAuthorUnsubmitted
Not Done
Inline Actions

The low bits are "volatile". Most vendor specifications say something to the effect that the revision is X in this version of the product and will be incremented in subsequent versions. Anyway, this is mostly moot as of all the devices out there I found only two that have 0x22 in the upper half.

avg: The low bits are "volatile". Most vendor specifications say something to the effect that the…
impUnsubmitted
Not Done
Inline Actions

Right, hence my comment: we should just have a blanket policy of ignoring them and have no need for it in this table.

imp: Right, hence my comment: we should just have a blanket policy of ignoring them and have no need…
avgAuthorUnsubmitted
Not Done
Inline Actions

I removed the generic device ID from the table...
I added it as a special case to ts_match_device though.

avg: I removed the generic device ID from the table... I added it as a special case to…
uint16_t device_id;
const char *description;
} known_devices[] = {
/*
* Analog Devices ADT7408.
* http://www.analog.com/media/en/technical-documentation/data-sheets/ADT7408.pdf
*/
{
0xffff, 0x11d4, 0xff00, 0x0800,
"Analog Devices DIMM temperature sensor"
},
/*
* Atmel AT30TSE002B, AT30TSE004A.
* http://www.atmel.com/images/doc8711.pdf
* http://www.atmel.com/images/atmel-8868-dts-at30tse004a-datasheet.pdf
* Note how one chip uses the JEDEC Manufacturer ID while the other
* uses the PCI SIG one.
*/
{
0xffff, 0x001f, 0xff00, 0x8200,
"Atmel DIMM temperature sensor"
},
{
0xffff, 0x1114, 0xff00, 0x2200,
"Atmel DIMM temperature sensor"
},
/*
* Integrated Device Technology (IDT) TS3000B3A, TSE2002B3C,
* TSE2004GB2B0 chips and their variants.
* http://www.idt.com/sites/default/files/documents/IDT_TSE2002B3C_DST_20100512_120303152056.pdf
* http://www.idt.com/sites/default/files/documents/IDT_TS3000B3A_DST_20101129_120303152013.pdf
* https://www.idt.com/document/dst/tse2004gb2b0-datasheet
*/
{
0xffff, 0x00b3, 0xff00, 0x2900,
"IDT DIMM temperature sensor"
},
{
0xffff, 0x00b3, 0xff00, 0x2200,
"IDT DIMM temperature sensor"
},
/*
* Maxim Integrated MAX6604.
* Different document revisions specify different Device IDs.
* Document 19-3837; Rev 0; 10/05 has 0x3e00 while
* 19-3837; Rev 3; 10/11 has 0x5400.
* http://datasheets.maximintegrated.com/en/ds/MAX6604.pdf
*/
{
0xffff, 0x004d, 0xff00, 0x3e00,
"Maxim Integrated DIMM temperature sensor"
},
{
0xffff, 0x004d, 0xff00, 0x5400,
"Maxim Integrated DIMM temperature sensor"
},
/*
* Microchip Technology MCP9805, MCP9843, MCP98242, MCP98243
* and their variants.
* http://ww1.microchip.com/downloads/en/DeviceDoc/21977b.pdf
* Microchip Technology EMC1501.
* http://ww1.microchip.com/downloads/en/DeviceDoc/00001605A.pdf
*/
{
0xffff, 0x0054, 0xff00, 0x0000,
"Microchip DIMM temperature sensor"
},
{
0xffff, 0x0054, 0xff00, 0x2000,
"Microchip DIMM temperature sensor"
},
{
0xffff, 0x0054, 0xff00, 0x2100,
"Microchip DIMM temperature sensor"
},
{
0xffff, 0x1055, 0xff00, 0x0800,
"Microchip DIMM temperature sensor"
},
/*
* NXP Semiconductors SE97 and SE98.
* http://www.nxp.com/docs/en/data-sheet/SE97B.pdf
*/
{
0xffff, 0x1131, 0xff00, 0xa100,
"NXP DIMM temperature sensor"
},
{
0xffff, 0x1131, 0xff00, 0xa200,
"NXP DIMM temperature sensor"
},
/*
* ON Semiconductor CAT34TS02 revisions B and C, CAT6095 and compatible.
* https://www.onsemi.com/pub/Collateral/CAT34TS02-D.PDF
* http://www.onsemi.com/pub/Collateral/CAT6095-D.PDF
*/
{
0xffff, 0x1b09, 0xff00, 0x0800,
"ON Semiconductor DIMM temperature sensor"
},
{
0xffff, 0x1b09, 0xff00, 0x0a00,
"ON Semiconductor DIMM temperature sensor"
},
/*
* ST[Microelectronics] STTS424E02, STTS2002 and others.
* http://www.st.com/resource/en/datasheet/cd00157558.pdf
* http://www.st.com/resource/en/datasheet/stts2002.pdf
*/
{
0xffff, 0x104a, 0xff00, 0x0000,
"ST DIMM temperature sensor"
},
{
0xffff, 0x104a, 0xff00, 0x0300,
"ST DIMM temperature sensor"
},
/* Generic TSE2004av compliant device. */
{
0x0000, 0x0000, 0xff00, 0x2200,
"TSE2004av compliant DIMM temperature sensor"
},
};
static const struct ts_dev *
ts_match_device(uint16_t vid, uint16_t did)
{
const struct ts_dev *d;
int i;
for (i = 0; i < nitems(known_devices); i++) {
d = &known_devices[i];
if ((vid & d->vendor_mask) == d->vendor_id &&
(did & d->device_mask) == d->device_id) {
return (d);
}
}
return (NULL);
}
/*
* SMBus specification defines little-endian byte order, * SMBus specification defines little-endian byte order,
* but it seems that the JEDEC devices expect it to * but it seems that the JEDEC devices expect it to
* be big-endian. * be big-endian.
*/ */
static int static int
ts_readw_be(device_t dev, uint8_t reg, uint16_t *val) ts_readw_be(device_t dev, uint8_t reg, uint16_t *val)
{ {
device_t bus = device_get_parent(dev); device_t bus = device_get_parent(dev);
Show All 31 Linests_temp_sysctl(SYSCTL_HANDLER_ARGS)
temp = temp * 625 + 2731500; temp = temp * 625 + 2731500;
err = sysctl_handle_int(oidp, &temp, 0, req); err = sysctl_handle_int(oidp, &temp, 0, req);
return (err); return (err);
} }
static int static int
ts_probe(device_t dev) ts_probe(device_t dev)
{ {
device_set_desc(dev, "DIMM memory sensor");
return (BUS_PROBE_DEFAULT); return (BUS_PROBE_DEFAULT);
} }
static int static int
ts_attach(device_t dev) ts_attach(device_t dev)
{ {
struct sysctl_ctx_list *ctx; struct sysctl_ctx_list *ctx;
struct sysctl_oid_list *tree; struct sysctl_oid_list *tree;
const struct ts_dev *match;
int err; int err;
uint16_t vendorid; uint16_t vendorid;
uint16_t devid; uint16_t devid;
uint8_t addr; uint8_t addr;
addr = smbus_get_addr(dev); addr = smbus_get_addr(dev);
if ((addr & 0xf0) != 0x30) { if ((addr & 0xf0) != 0x30) {
/* Up to 8 slave devices starting at 0x30. */ /* Up to 8 slave devices starting at 0x30. */
return (ENXIO); return (ENXIO);
} }
err = ts_readw_be(dev, 6, &vendorid); err = ts_readw_be(dev, 6, &vendorid);
if (err != 0) { if (err != 0) {
device_printf(dev, "failed to read Manufacturer ID\n"); device_printf(dev, "failed to read Manufacturer ID\n");
return (ENXIO); return (ENXIO);
} }
err = ts_readw_be(dev, 7, &devid); err = ts_readw_be(dev, 7, &devid);
if (err != 0) { if (err != 0) {
device_printf(dev, "failed to read Device ID\n"); device_printf(dev, "failed to read Device ID\n");
return (ENXIO); return (ENXIO);
} }
if ((devid & 0xff00) == 0x2200) {
/* match = ts_match_device(vendorid, devid);
* Defined by JEDEC Standard No. 21-C, Release 26, if (match == NULL) {
* Page 4.1.6 – 24
*/
} else if (vendorid == 0x104a) {
/*
* STMicroelectronics datasheets say that
* device ID and revision can vary.
* E.g. STT424E02, Doc ID 13448 Rev 8,
* section 4.6, page 26.
*/
} else if (vendorid == 0xb3 && (devid & 0xff00) == 0x2900) {
/*
* IDT TS3000B3A and TSE2002B3C chips and their variants.
* Revision IDs (the lower byte) can vary.
* http://www.idt.com/sites/default/files/documents/IDT_TSE2002B3C_DST_20100512_120303152056.pdf
* http://www.idt.com/sites/default/files/documents/IDT_TS3000B3A_DST_20101129_120303152013.pdf
*/
} else {
if (bootverbose) { if (bootverbose) {
device_printf(dev, "Unknown Manufacturer and Device IDs" device_printf(dev, "Unknown Manufacturer and Device IDs"
", 0x%x and 0x%x\n", vendorid, devid); ", 0x%x and 0x%x\n", vendorid, devid);
} }
return (ENXIO); return (ENXIO);
} }
device_set_desc(dev, match->description);
ctx = device_get_sysctl_ctx(dev); ctx = device_get_sysctl_ctx(dev);
tree = SYSCTL_CHILDREN(device_get_sysctl_tree(dev)); tree = SYSCTL_CHILDREN(device_get_sysctl_tree(dev));
SYSCTL_ADD_PROC(ctx, tree, OID_AUTO, "temp", SYSCTL_ADD_PROC(ctx, tree, OID_AUTO, "temp",
CTLTYPE_INT | CTLFLAG_RD | CTLFLAG_MPSAFE, dev, 0, CTLTYPE_INT | CTLFLAG_RD | CTLFLAG_MPSAFE, dev, 0,
ts_temp_sysctl, "IK4", "Current temperature"); ts_temp_sysctl, "IK4", "Current temperature");
return (0); return (0);
} }
static int static int
Show All 27 Lines
View Options

sys/sys/aio.h

Show All 36 Lines
#include <dev/smbus/smbconf.h> #include <dev/smbus/smbconf.h>
#include <dev/smbus/smbus.h> #include <dev/smbus/smbus.h>
#include "smbus_if.h" #include "smbus_if.h"
/* /*
* General device identification notes.
*
* The JEDEC TSE2004av specification defines the device ID that all compliant
* devices should use, but very few do in practice. Maybe that's because
* TSE2002av was rather vague about that.
* Rare examples are IDT TSE2004GB2B0 and Atmel AT30TSE004A, not sure if
* they are TSE2004av compliant by design or by accident.
* Also, the specification mandates that PCI SIG manufacturer IDs are to be
* used, but in practice the JEDEC manufacturer IDs are often used.
*/
rpokalaUnsubmitted
Not Done
Inline Actions

Add a note saying that the spec requires the upper byte of the device_id be 0x22, but that most vendors don't honor that, so that's why we're not checking for it. That makes the 0x22 in the generic case a bit less magic.

rpokala: Add a note saying that the spec requires the upper byte of the device_id be 0x22, but that most…
avgAuthorUnsubmitted
Not Done
Inline Actions

Isn't this comment the comment that you are requesting?

avg: Isn't this comment the comment that you are requesting?
rpokalaUnsubmitted
Not Done
Inline Actions

Err, yes - partly. It mentions that few use the proper one. How about:

... devices should use (high-order byte 0x22), but very few do in practice ...

rpokala: Err, yes - partly. It mentions that few use the proper one. How about: > ... devices should…
avgAuthorUnsubmitted
Not Done
Inline Actions

I think that this comment is fine as is. There is another comment in the code where the magic device ID is actually used.

avg: I think that this comment is fine as is. There is another comment in the code where the magic…
const struct ts_dev {
uint16_t vendor_mask;
impUnsubmitted
Done
Inline Actions

Since the vendor mask is always 0xffff, why have it? It only seems useful for the catch-all at the end...

imp: Since the vendor mask is always 0xffff, why have it? It only seems useful for the catch-all at…
uint16_t vendor_id;
uint16_t device_mask;
impUnsubmitted
Done
Inline Actions

device_mask is likewise always 0xff00. Looks like the lower 8 bits are supposed to be a revision number. I see why you want to mask it, but realistically, will there ever be a time we'd have two different entries here?

imp: device_mask is likewise always 0xff00. Looks like the lower 8 bits are supposed to be a…
rpokalaUnsubmitted
Not Done
Inline Actions

JEDEC Standard No. 21-C
2.24. TSE2004av Device ID / Revision Register
The upper byte of the Device ID / Revision Register must be 0x22 for the TSE2004av. The lower byte holds the revision value which is vendor-specific. This register is not available on EE1004-v devices.

Based on that, we should be looking at all four nybbles, which should be 0x22XX. But as pointed out in the comment, not everyone uses the correct device ID. Since it's the low-order bits which are vendor-specific, shouldn't we only look at those for identification?

(But maybe the vendor datasheets indicate that the low-order bits might be different even for the same part? I haven't looked at them yet; I'll do that later today. If that's the case, then I'd say we shouldn't look at the device-id at all.)

rpokala: > JEDEC Standard No. 21-C > 2.24. TSE2004av Device ID / Revision Register > The upper byte of…
avgAuthorUnsubmitted
Not Done
Inline Actions

The low bits are "volatile". Most vendor specifications say something to the effect that the revision is X in this version of the product and will be incremented in subsequent versions. Anyway, this is mostly moot as of all the devices out there I found only two that have 0x22 in the upper half.

avg: The low bits are "volatile". Most vendor specifications say something to the effect that the…
impUnsubmitted
Not Done
Inline Actions

Right, hence my comment: we should just have a blanket policy of ignoring them and have no need for it in this table.

imp: Right, hence my comment: we should just have a blanket policy of ignoring them and have no need…
avgAuthorUnsubmitted
Not Done
Inline Actions

I removed the generic device ID from the table...
I added it as a special case to ts_match_device though.

avg: I removed the generic device ID from the table... I added it as a special case to…
uint16_t device_id;
const char *description;
} known_devices[] = {
/*
* Analog Devices ADT7408.
* http://www.analog.com/media/en/technical-documentation/data-sheets/ADT7408.pdf
*/
{
0xffff, 0x11d4, 0xff00, 0x0800,
"Analog Devices DIMM temperature sensor"
},
/*
* Atmel AT30TSE002B, AT30TSE004A.
* http://www.atmel.com/images/doc8711.pdf
* http://www.atmel.com/images/atmel-8868-dts-at30tse004a-datasheet.pdf
* Note how one chip uses the JEDEC Manufacturer ID while the other
* uses the PCI SIG one.
*/
{
0xffff, 0x001f, 0xff00, 0x8200,
"Atmel DIMM temperature sensor"
},
{
0xffff, 0x1114, 0xff00, 0x2200,
"Atmel DIMM temperature sensor"
},
/*
* Integrated Device Technology (IDT) TS3000B3A, TSE2002B3C,
* TSE2004GB2B0 chips and their variants.
* http://www.idt.com/sites/default/files/documents/IDT_TSE2002B3C_DST_20100512_120303152056.pdf
* http://www.idt.com/sites/default/files/documents/IDT_TS3000B3A_DST_20101129_120303152013.pdf
* https://www.idt.com/document/dst/tse2004gb2b0-datasheet
*/
{
0xffff, 0x00b3, 0xff00, 0x2900,
"IDT DIMM temperature sensor"
},
{
0xffff, 0x00b3, 0xff00, 0x2200,
"IDT DIMM temperature sensor"
},
/*
* Maxim Integrated MAX6604.
* Different document revisions specify different Device IDs.
* Document 19-3837; Rev 0; 10/05 has 0x3e00 while
* 19-3837; Rev 3; 10/11 has 0x5400.
* http://datasheets.maximintegrated.com/en/ds/MAX6604.pdf
*/
{
0xffff, 0x004d, 0xff00, 0x3e00,
"Maxim Integrated DIMM temperature sensor"
},
{
0xffff, 0x004d, 0xff00, 0x5400,
"Maxim Integrated DIMM temperature sensor"
},
/*
* Microchip Technology MCP9805, MCP9843, MCP98242, MCP98243
* and their variants.
* http://ww1.microchip.com/downloads/en/DeviceDoc/21977b.pdf
* Microchip Technology EMC1501.
* http://ww1.microchip.com/downloads/en/DeviceDoc/00001605A.pdf
*/
{
0xffff, 0x0054, 0xff00, 0x0000,
"Microchip DIMM temperature sensor"
},
{
0xffff, 0x0054, 0xff00, 0x2000,
"Microchip DIMM temperature sensor"
},
{
0xffff, 0x0054, 0xff00, 0x2100,
"Microchip DIMM temperature sensor"
},
{
0xffff, 0x1055, 0xff00, 0x0800,
"Microchip DIMM temperature sensor"
},
/*
* NXP Semiconductors SE97 and SE98.
* http://www.nxp.com/docs/en/data-sheet/SE97B.pdf
*/
{
0xffff, 0x1131, 0xff00, 0xa100,
"NXP DIMM temperature sensor"
},
{
0xffff, 0x1131, 0xff00, 0xa200,
"NXP DIMM temperature sensor"
},
/*
* ON Semiconductor CAT34TS02 revisions B and C, CAT6095 and compatible.
* https://www.onsemi.com/pub/Collateral/CAT34TS02-D.PDF
* http://www.onsemi.com/pub/Collateral/CAT6095-D.PDF
*/
{
0xffff, 0x1b09, 0xff00, 0x0800,
"ON Semiconductor DIMM temperature sensor"
},
{
0xffff, 0x1b09, 0xff00, 0x0a00,
"ON Semiconductor DIMM temperature sensor"
},
/*
* ST[Microelectronics] STTS424E02, STTS2002 and others.
* http://www.st.com/resource/en/datasheet/cd00157558.pdf
* http://www.st.com/resource/en/datasheet/stts2002.pdf
*/
{
0xffff, 0x104a, 0xff00, 0x0000,
"ST DIMM temperature sensor"
},
{
0xffff, 0x104a, 0xff00, 0x0300,
"ST DIMM temperature sensor"
},
/* Generic TSE2004av compliant device. */
{
0x0000, 0x0000, 0xff00, 0x2200,
"TSE2004av compliant DIMM temperature sensor"
},
};
static const struct ts_dev *
ts_match_device(uint16_t vid, uint16_t did)
{
const struct ts_dev *d;
int i;
for (i = 0; i < nitems(known_devices); i++) {
d = &known_devices[i];
if ((vid & d->vendor_mask) == d->vendor_id &&
(did & d->device_mask) == d->device_id) {
return (d);
}
}
return (NULL);
}
/*
* SMBus specification defines little-endian byte order, * SMBus specification defines little-endian byte order,
* but it seems that the JEDEC devices expect it to * but it seems that the JEDEC devices expect it to
* be big-endian. * be big-endian.
*/ */
static int static int
ts_readw_be(device_t dev, uint8_t reg, uint16_t *val) ts_readw_be(device_t dev, uint8_t reg, uint16_t *val)
{ {
device_t bus = device_get_parent(dev); device_t bus = device_get_parent(dev);
Show All 31 Linests_temp_sysctl(SYSCTL_HANDLER_ARGS)
temp = temp * 625 + 2731500; temp = temp * 625 + 2731500;
err = sysctl_handle_int(oidp, &temp, 0, req); err = sysctl_handle_int(oidp, &temp, 0, req);
return (err); return (err);
} }
static int static int
ts_probe(device_t dev) ts_probe(device_t dev)
{ {
device_set_desc(dev, "DIMM memory sensor");
return (BUS_PROBE_DEFAULT); return (BUS_PROBE_DEFAULT);
} }
static int static int
ts_attach(device_t dev) ts_attach(device_t dev)
{ {
struct sysctl_ctx_list *ctx; struct sysctl_ctx_list *ctx;
struct sysctl_oid_list *tree; struct sysctl_oid_list *tree;
const struct ts_dev *match;
int err; int err;
uint16_t vendorid; uint16_t vendorid;
uint16_t devid; uint16_t devid;
uint8_t addr; uint8_t addr;
addr = smbus_get_addr(dev); addr = smbus_get_addr(dev);
if ((addr & 0xf0) != 0x30) { if ((addr & 0xf0) != 0x30) {
/* Up to 8 slave devices starting at 0x30. */ /* Up to 8 slave devices starting at 0x30. */
return (ENXIO); return (ENXIO);
} }
err = ts_readw_be(dev, 6, &vendorid); err = ts_readw_be(dev, 6, &vendorid);
if (err != 0) { if (err != 0) {
device_printf(dev, "failed to read Manufacturer ID\n"); device_printf(dev, "failed to read Manufacturer ID\n");
return (ENXIO); return (ENXIO);
} }
err = ts_readw_be(dev, 7, &devid); err = ts_readw_be(dev, 7, &devid);
if (err != 0) { if (err != 0) {
device_printf(dev, "failed to read Device ID\n"); device_printf(dev, "failed to read Device ID\n");
return (ENXIO); return (ENXIO);
} }
if ((devid & 0xff00) == 0x2200) {
/* match = ts_match_device(vendorid, devid);
* Defined by JEDEC Standard No. 21-C, Release 26, if (match == NULL) {
* Page 4.1.6 – 24
*/
} else if (vendorid == 0x104a) {
/*
* STMicroelectronics datasheets say that
* device ID and revision can vary.
* E.g. STT424E02, Doc ID 13448 Rev 8,
* section 4.6, page 26.
*/
} else if (vendorid == 0xb3 && (devid & 0xff00) == 0x2900) {
/*
* IDT TS3000B3A and TSE2002B3C chips and their variants.
* Revision IDs (the lower byte) can vary.
* http://www.idt.com/sites/default/files/documents/IDT_TSE2002B3C_DST_20100512_120303152056.pdf
* http://www.idt.com/sites/default/files/documents/IDT_TS3000B3A_DST_20101129_120303152013.pdf
*/
} else {
if (bootverbose) { if (bootverbose) {
device_printf(dev, "Unknown Manufacturer and Device IDs" device_printf(dev, "Unknown Manufacturer and Device IDs"
", 0x%x and 0x%x\n", vendorid, devid); ", 0x%x and 0x%x\n", vendorid, devid);
} }
return (ENXIO); return (ENXIO);
} }
device_set_desc(dev, match->description);
ctx = device_get_sysctl_ctx(dev); ctx = device_get_sysctl_ctx(dev);
tree = SYSCTL_CHILDREN(device_get_sysctl_tree(dev)); tree = SYSCTL_CHILDREN(device_get_sysctl_tree(dev));
SYSCTL_ADD_PROC(ctx, tree, OID_AUTO, "temp", SYSCTL_ADD_PROC(ctx, tree, OID_AUTO, "temp",
CTLTYPE_INT | CTLFLAG_RD | CTLFLAG_MPSAFE, dev, 0, CTLTYPE_INT | CTLFLAG_RD | CTLFLAG_MPSAFE, dev, 0,
ts_temp_sysctl, "IK4", "Current temperature"); ts_temp_sysctl, "IK4", "Current temperature");
return (0); return (0);
} }
static int static int
Show All 27 Lines
View Options

tests/sys/aio/lio_test.c

Show All 36 Lines
#include <dev/smbus/smbconf.h> #include <dev/smbus/smbconf.h>
#include <dev/smbus/smbus.h> #include <dev/smbus/smbus.h>
#include "smbus_if.h" #include "smbus_if.h"
/* /*
* General device identification notes.
*
* The JEDEC TSE2004av specification defines the device ID that all compliant
* devices should use, but very few do in practice. Maybe that's because
* TSE2002av was rather vague about that.
* Rare examples are IDT TSE2004GB2B0 and Atmel AT30TSE004A, not sure if
* they are TSE2004av compliant by design or by accident.
* Also, the specification mandates that PCI SIG manufacturer IDs are to be
* used, but in practice the JEDEC manufacturer IDs are often used.
*/
rpokalaUnsubmitted
Not Done
Inline Actions

Add a note saying that the spec requires the upper byte of the device_id be 0x22, but that most vendors don't honor that, so that's why we're not checking for it. That makes the 0x22 in the generic case a bit less magic.

rpokala: Add a note saying that the spec requires the upper byte of the device_id be 0x22, but that most…
avgAuthorUnsubmitted
Not Done
Inline Actions

Isn't this comment the comment that you are requesting?

avg: Isn't this comment the comment that you are requesting?
rpokalaUnsubmitted
Not Done
Inline Actions

Err, yes - partly. It mentions that few use the proper one. How about:

... devices should use (high-order byte 0x22), but very few do in practice ...

rpokala: Err, yes - partly. It mentions that few use the proper one. How about: > ... devices should…
avgAuthorUnsubmitted
Not Done
Inline Actions

I think that this comment is fine as is. There is another comment in the code where the magic device ID is actually used.

avg: I think that this comment is fine as is. There is another comment in the code where the magic…
const struct ts_dev {
uint16_t vendor_mask;
impUnsubmitted
Done
Inline Actions

Since the vendor mask is always 0xffff, why have it? It only seems useful for the catch-all at the end...

imp: Since the vendor mask is always 0xffff, why have it? It only seems useful for the catch-all at…
uint16_t vendor_id;
uint16_t device_mask;
impUnsubmitted
Done
Inline Actions

device_mask is likewise always 0xff00. Looks like the lower 8 bits are supposed to be a revision number. I see why you want to mask it, but realistically, will there ever be a time we'd have two different entries here?

imp: device_mask is likewise always 0xff00. Looks like the lower 8 bits are supposed to be a…
rpokalaUnsubmitted
Not Done
Inline Actions

JEDEC Standard No. 21-C
2.24. TSE2004av Device ID / Revision Register
The upper byte of the Device ID / Revision Register must be 0x22 for the TSE2004av. The lower byte holds the revision value which is vendor-specific. This register is not available on EE1004-v devices.

Based on that, we should be looking at all four nybbles, which should be 0x22XX. But as pointed out in the comment, not everyone uses the correct device ID. Since it's the low-order bits which are vendor-specific, shouldn't we only look at those for identification?

(But maybe the vendor datasheets indicate that the low-order bits might be different even for the same part? I haven't looked at them yet; I'll do that later today. If that's the case, then I'd say we shouldn't look at the device-id at all.)

rpokala: > JEDEC Standard No. 21-C > 2.24. TSE2004av Device ID / Revision Register > The upper byte of…
avgAuthorUnsubmitted
Not Done
Inline Actions

The low bits are "volatile". Most vendor specifications say something to the effect that the revision is X in this version of the product and will be incremented in subsequent versions. Anyway, this is mostly moot as of all the devices out there I found only two that have 0x22 in the upper half.

avg: The low bits are "volatile". Most vendor specifications say something to the effect that the…
impUnsubmitted
Not Done
Inline Actions

Right, hence my comment: we should just have a blanket policy of ignoring them and have no need for it in this table.

imp: Right, hence my comment: we should just have a blanket policy of ignoring them and have no need…
avgAuthorUnsubmitted
Not Done
Inline Actions

I removed the generic device ID from the table...
I added it as a special case to ts_match_device though.

avg: I removed the generic device ID from the table... I added it as a special case to…
uint16_t device_id;
const char *description;
} known_devices[] = {
/*
* Analog Devices ADT7408.
* http://www.analog.com/media/en/technical-documentation/data-sheets/ADT7408.pdf
*/
{
0xffff, 0x11d4, 0xff00, 0x0800,
"Analog Devices DIMM temperature sensor"
},
/*
* Atmel AT30TSE002B, AT30TSE004A.
* http://www.atmel.com/images/doc8711.pdf
* http://www.atmel.com/images/atmel-8868-dts-at30tse004a-datasheet.pdf
* Note how one chip uses the JEDEC Manufacturer ID while the other
* uses the PCI SIG one.
*/
{
0xffff, 0x001f, 0xff00, 0x8200,
"Atmel DIMM temperature sensor"
},
{
0xffff, 0x1114, 0xff00, 0x2200,
"Atmel DIMM temperature sensor"
},
/*
* Integrated Device Technology (IDT) TS3000B3A, TSE2002B3C,
* TSE2004GB2B0 chips and their variants.
* http://www.idt.com/sites/default/files/documents/IDT_TSE2002B3C_DST_20100512_120303152056.pdf
* http://www.idt.com/sites/default/files/documents/IDT_TS3000B3A_DST_20101129_120303152013.pdf
* https://www.idt.com/document/dst/tse2004gb2b0-datasheet
*/
{
0xffff, 0x00b3, 0xff00, 0x2900,
"IDT DIMM temperature sensor"
},
{
0xffff, 0x00b3, 0xff00, 0x2200,
"IDT DIMM temperature sensor"
},
/*
* Maxim Integrated MAX6604.
* Different document revisions specify different Device IDs.
* Document 19-3837; Rev 0; 10/05 has 0x3e00 while
* 19-3837; Rev 3; 10/11 has 0x5400.
* http://datasheets.maximintegrated.com/en/ds/MAX6604.pdf
*/
{
0xffff, 0x004d, 0xff00, 0x3e00,
"Maxim Integrated DIMM temperature sensor"
},
{
0xffff, 0x004d, 0xff00, 0x5400,
"Maxim Integrated DIMM temperature sensor"
},
/*
* Microchip Technology MCP9805, MCP9843, MCP98242, MCP98243
* and their variants.
* http://ww1.microchip.com/downloads/en/DeviceDoc/21977b.pdf
* Microchip Technology EMC1501.
* http://ww1.microchip.com/downloads/en/DeviceDoc/00001605A.pdf
*/
{
0xffff, 0x0054, 0xff00, 0x0000,
"Microchip DIMM temperature sensor"
},
{
0xffff, 0x0054, 0xff00, 0x2000,
"Microchip DIMM temperature sensor"
},
{
0xffff, 0x0054, 0xff00, 0x2100,
"Microchip DIMM temperature sensor"
},
{
0xffff, 0x1055, 0xff00, 0x0800,
"Microchip DIMM temperature sensor"
},
/*
* NXP Semiconductors SE97 and SE98.
* http://www.nxp.com/docs/en/data-sheet/SE97B.pdf
*/
{
0xffff, 0x1131, 0xff00, 0xa100,
"NXP DIMM temperature sensor"
},
{
0xffff, 0x1131, 0xff00, 0xa200,
"NXP DIMM temperature sensor"
},
/*
* ON Semiconductor CAT34TS02 revisions B and C, CAT6095 and compatible.
* https://www.onsemi.com/pub/Collateral/CAT34TS02-D.PDF
* http://www.onsemi.com/pub/Collateral/CAT6095-D.PDF
*/
{
0xffff, 0x1b09, 0xff00, 0x0800,
"ON Semiconductor DIMM temperature sensor"
},
{
0xffff, 0x1b09, 0xff00, 0x0a00,
"ON Semiconductor DIMM temperature sensor"
},
/*
* ST[Microelectronics] STTS424E02, STTS2002 and others.
* http://www.st.com/resource/en/datasheet/cd00157558.pdf
* http://www.st.com/resource/en/datasheet/stts2002.pdf
*/
{
0xffff, 0x104a, 0xff00, 0x0000,
"ST DIMM temperature sensor"
},
{
0xffff, 0x104a, 0xff00, 0x0300,
"ST DIMM temperature sensor"
},
/* Generic TSE2004av compliant device. */
{
0x0000, 0x0000, 0xff00, 0x2200,
"TSE2004av compliant DIMM temperature sensor"
},
};
static const struct ts_dev *
ts_match_device(uint16_t vid, uint16_t did)
{
const struct ts_dev *d;
int i;
for (i = 0; i < nitems(known_devices); i++) {
d = &known_devices[i];
if ((vid & d->vendor_mask) == d->vendor_id &&
(did & d->device_mask) == d->device_id) {
return (d);
}
}
return (NULL);
}
/*
* SMBus specification defines little-endian byte order, * SMBus specification defines little-endian byte order,
* but it seems that the JEDEC devices expect it to * but it seems that the JEDEC devices expect it to
* be big-endian. * be big-endian.
*/ */
static int static int
ts_readw_be(device_t dev, uint8_t reg, uint16_t *val) ts_readw_be(device_t dev, uint8_t reg, uint16_t *val)
{ {
device_t bus = device_get_parent(dev); device_t bus = device_get_parent(dev);
Show All 31 Linests_temp_sysctl(SYSCTL_HANDLER_ARGS)
temp = temp * 625 + 2731500; temp = temp * 625 + 2731500;
err = sysctl_handle_int(oidp, &temp, 0, req); err = sysctl_handle_int(oidp, &temp, 0, req);
return (err); return (err);
} }
static int static int
ts_probe(device_t dev) ts_probe(device_t dev)
{ {
device_set_desc(dev, "DIMM memory sensor");
return (BUS_PROBE_DEFAULT); return (BUS_PROBE_DEFAULT);
} }
static int static int
ts_attach(device_t dev) ts_attach(device_t dev)
{ {
struct sysctl_ctx_list *ctx; struct sysctl_ctx_list *ctx;
struct sysctl_oid_list *tree; struct sysctl_oid_list *tree;
const struct ts_dev *match;
int err; int err;
uint16_t vendorid; uint16_t vendorid;
uint16_t devid; uint16_t devid;
uint8_t addr; uint8_t addr;
addr = smbus_get_addr(dev); addr = smbus_get_addr(dev);
if ((addr & 0xf0) != 0x30) { if ((addr & 0xf0) != 0x30) {
/* Up to 8 slave devices starting at 0x30. */ /* Up to 8 slave devices starting at 0x30. */
return (ENXIO); return (ENXIO);
} }
err = ts_readw_be(dev, 6, &vendorid); err = ts_readw_be(dev, 6, &vendorid);
if (err != 0) { if (err != 0) {
device_printf(dev, "failed to read Manufacturer ID\n"); device_printf(dev, "failed to read Manufacturer ID\n");
return (ENXIO); return (ENXIO);
} }
err = ts_readw_be(dev, 7, &devid); err = ts_readw_be(dev, 7, &devid);
if (err != 0) { if (err != 0) {
device_printf(dev, "failed to read Device ID\n"); device_printf(dev, "failed to read Device ID\n");
return (ENXIO); return (ENXIO);
} }
if ((devid & 0xff00) == 0x2200) {
/* match = ts_match_device(vendorid, devid);
* Defined by JEDEC Standard No. 21-C, Release 26, if (match == NULL) {
* Page 4.1.6 – 24
*/
} else if (vendorid == 0x104a) {
/*
* STMicroelectronics datasheets say that
* device ID and revision can vary.
* E.g. STT424E02, Doc ID 13448 Rev 8,
* section 4.6, page 26.
*/
} else if (vendorid == 0xb3 && (devid & 0xff00) == 0x2900) {
/*
* IDT TS3000B3A and TSE2002B3C chips and their variants.
* Revision IDs (the lower byte) can vary.
* http://www.idt.com/sites/default/files/documents/IDT_TSE2002B3C_DST_20100512_120303152056.pdf
* http://www.idt.com/sites/default/files/documents/IDT_TS3000B3A_DST_20101129_120303152013.pdf
*/
} else {
if (bootverbose) { if (bootverbose) {
device_printf(dev, "Unknown Manufacturer and Device IDs" device_printf(dev, "Unknown Manufacturer and Device IDs"
", 0x%x and 0x%x\n", vendorid, devid); ", 0x%x and 0x%x\n", vendorid, devid);
} }
return (ENXIO); return (ENXIO);
} }
device_set_desc(dev, match->description);
ctx = device_get_sysctl_ctx(dev); ctx = device_get_sysctl_ctx(dev);
tree = SYSCTL_CHILDREN(device_get_sysctl_tree(dev)); tree = SYSCTL_CHILDREN(device_get_sysctl_tree(dev));
SYSCTL_ADD_PROC(ctx, tree, OID_AUTO, "temp", SYSCTL_ADD_PROC(ctx, tree, OID_AUTO, "temp",
CTLTYPE_INT | CTLFLAG_RD | CTLFLAG_MPSAFE, dev, 0, CTLTYPE_INT | CTLFLAG_RD | CTLFLAG_MPSAFE, dev, 0,
ts_temp_sysctl, "IK4", "Current temperature"); ts_temp_sysctl, "IK4", "Current temperature");
return (0); return (0);
} }
static int static int
Show All 27 Lines
View Options

usr.bin/truss/syscalls.c

Loading...