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sysutils/powerdxx: update to version 0.3.0
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Authored by rigoletto on Jan 11 2018, 3:34 AM.
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swills
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rP460769: sysutils/powerdxx: update to version 0.3.0
Summary
  • update to v. 0.3.0
  • switch to DISTVERSION
  • add USE_LDCONFIG

Diff Detail

Repository
rP FreeBSD ports repository
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Build Status
Buildable 14346
Build 14503: arc lint + arc unit

Event Timeline

rigoletto created this revision.Jan 11 2018, 3:34 AM
Herald added subscribers: Contributor Reviewers (ports), mat. · View Herald TranscriptJan 11 2018, 3:34 AM
Harbormaster completed remote builds in B14286: Diff 37775.Jan 11 2018, 3:34 AM
rigoletto added a comment.Jan 11 2018, 1:40 PM

Seems still needs work.

rigoletto updated this revision to Diff 37812.EditedJan 11 2018, 4:49 PM

Add git sub-module and DOC OPTION.

Harbormaster completed remote builds in B14303: Diff 37812.Jan 11 2018, 4:49 PM
tobik added a subscriber: tobik.Jan 11 2018, 6:31 PM
tobik added inline comments.
sysutils/powerdxx/Makefile
20

The DOCS NLS EXAMPLES IPV6 options are always enabled by default, so you do not need to add them to OPTIONS_DEFAULT.

rigoletto updated this revision to Diff 37835.Jan 11 2018, 7:06 PM
rigoletto marked an inline comment as done.

Removing OPTIONS_DEFAULT.

Harbormaster completed remote builds in B14314: Diff 37835.Jan 11 2018, 7:06 PM
rigoletto updated this revision to Diff 37836.EditedJan 11 2018, 7:07 PM

Fixing the mistake the last Diff was.

Sorry.

Harbormaster completed remote builds in B14315: Diff 37836.Jan 11 2018, 7:07 PM
rigoletto added a reviewer: swills.Jan 12 2018, 5:45 PM
swills added a comment.Jan 12 2018, 9:31 PM

This doesn't build on 10.3.

rigoletto updated this revision to Diff 37899.Jan 13 2018, 12:04 AM

Switch to "compiler:c++14-lang". Build on 10.3.

Thanks!

lme added a subscriber: lme.Feb 1 2018, 2:16 PM
lme added inline comments.
sysutils/powerdxx/Makefile
7

The port does not have a maintainer. Do you like to maintain it?

rigoletto updated this revision to Diff 38758.Feb 1 2018, 2:37 PM
rigoletto marked an inline comment as done.

Taking maintainership. :)

Harbormaster completed remote builds in B14728: Diff 38758.Feb 1 2018, 2:37 PM
This revision was not accepted when it landed; it landed in state Needs Review.Feb 3 2018, 3:54 AM
Closed by commit rP460769: sysutils/powerdxx: update to version 0.3.0 (authored by swills). · Explain Why
This revision was automatically updated to reflect the committed changes.

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sysutils/
powerdxx/
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Diff 37899

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sysutils/powerdxx/Makefile

Show All 36 Lines
#include <dev/smbus/smbconf.h> #include <dev/smbus/smbconf.h>
#include <dev/smbus/smbus.h> #include <dev/smbus/smbus.h>
#include "smbus_if.h" #include "smbus_if.h"
/* /*
* General device identification notes.
*
* The JEDEC TSE2004av specification defines the device ID that all compliant
* devices should use, but very few do in practice. Maybe that's because
* TSE2002av was rather vague about that.
* Rare examples are IDT TSE2004GB2B0 and Atmel AT30TSE004A, not sure if
* they are TSE2004av compliant by design or by accident.
* Also, the specification mandates that PCI SIG manufacturer IDs are to be
* used, but in practice the JEDEC manufacturer IDs are often used.
*/
rpokalaUnsubmitted
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Add a note saying that the spec requires the upper byte of the device_id be 0x22, but that most vendors don't honor that, so that's why we're not checking for it. That makes the 0x22 in the generic case a bit less magic.

rpokala: Add a note saying that the spec requires the upper byte of the device_id be 0x22, but that most…
avgAuthorUnsubmitted
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Isn't this comment the comment that you are requesting?

avg: Isn't this comment the comment that you are requesting?
rpokalaUnsubmitted
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Err, yes - partly. It mentions that few use the proper one. How about:

... devices should use (high-order byte 0x22), but very few do in practice ...

rpokala: Err, yes - partly. It mentions that few use the proper one. How about: > ... devices should…
avgAuthorUnsubmitted
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I think that this comment is fine as is. There is another comment in the code where the magic device ID is actually used.

avg: I think that this comment is fine as is. There is another comment in the code where the magic…
const struct ts_dev {
uint16_t vendor_mask;
impUnsubmitted
Done
Inline Actions

Since the vendor mask is always 0xffff, why have it? It only seems useful for the catch-all at the end...

imp: Since the vendor mask is always 0xffff, why have it? It only seems useful for the catch-all at…
uint16_t vendor_id;
uint16_t device_mask;
impUnsubmitted
Done
Inline Actions

device_mask is likewise always 0xff00. Looks like the lower 8 bits are supposed to be a revision number. I see why you want to mask it, but realistically, will there ever be a time we'd have two different entries here?

imp: device_mask is likewise always 0xff00. Looks like the lower 8 bits are supposed to be a…
rpokalaUnsubmitted
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JEDEC Standard No. 21-C
2.24. TSE2004av Device ID / Revision Register
The upper byte of the Device ID / Revision Register must be 0x22 for the TSE2004av. The lower byte holds the revision value which is vendor-specific. This register is not available on EE1004-v devices.

Based on that, we should be looking at all four nybbles, which should be 0x22XX. But as pointed out in the comment, not everyone uses the correct device ID. Since it's the low-order bits which are vendor-specific, shouldn't we only look at those for identification?

(But maybe the vendor datasheets indicate that the low-order bits might be different even for the same part? I haven't looked at them yet; I'll do that later today. If that's the case, then I'd say we shouldn't look at the device-id at all.)

rpokala: > JEDEC Standard No. 21-C > 2.24. TSE2004av Device ID / Revision Register > The upper byte of…
avgAuthorUnsubmitted
Not Done
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The low bits are "volatile". Most vendor specifications say something to the effect that the revision is X in this version of the product and will be incremented in subsequent versions. Anyway, this is mostly moot as of all the devices out there I found only two that have 0x22 in the upper half.

avg: The low bits are "volatile". Most vendor specifications say something to the effect that the…
impUnsubmitted
Not Done
Inline Actions

Right, hence my comment: we should just have a blanket policy of ignoring them and have no need for it in this table.

imp: Right, hence my comment: we should just have a blanket policy of ignoring them and have no need…
avgAuthorUnsubmitted
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I removed the generic device ID from the table...
I added it as a special case to ts_match_device though.

avg: I removed the generic device ID from the table... I added it as a special case to…
uint16_t device_id;
const char *description;
} known_devices[] = {
/*
* Analog Devices ADT7408.
* http://www.analog.com/media/en/technical-documentation/data-sheets/ADT7408.pdf
*/
{
0xffff, 0x11d4, 0xff00, 0x0800,
"Analog Devices DIMM temperature sensor"
},
/*
* Atmel AT30TSE002B, AT30TSE004A.
* http://www.atmel.com/images/doc8711.pdf
* http://www.atmel.com/images/atmel-8868-dts-at30tse004a-datasheet.pdf
* Note how one chip uses the JEDEC Manufacturer ID while the other
* uses the PCI SIG one.
*/
{
0xffff, 0x001f, 0xff00, 0x8200,
"Atmel DIMM temperature sensor"
},
{
0xffff, 0x1114, 0xff00, 0x2200,
"Atmel DIMM temperature sensor"
},
/*
* Integrated Device Technology (IDT) TS3000B3A, TSE2002B3C,
* TSE2004GB2B0 chips and their variants.
* http://www.idt.com/sites/default/files/documents/IDT_TSE2002B3C_DST_20100512_120303152056.pdf
* http://www.idt.com/sites/default/files/documents/IDT_TS3000B3A_DST_20101129_120303152013.pdf
* https://www.idt.com/document/dst/tse2004gb2b0-datasheet
*/
{
0xffff, 0x00b3, 0xff00, 0x2900,
"IDT DIMM temperature sensor"
},
{
0xffff, 0x00b3, 0xff00, 0x2200,
"IDT DIMM temperature sensor"
},
/*
* Maxim Integrated MAX6604.
* Different document revisions specify different Device IDs.
* Document 19-3837; Rev 0; 10/05 has 0x3e00 while
* 19-3837; Rev 3; 10/11 has 0x5400.
* http://datasheets.maximintegrated.com/en/ds/MAX6604.pdf
*/
{
0xffff, 0x004d, 0xff00, 0x3e00,
"Maxim Integrated DIMM temperature sensor"
},
{
0xffff, 0x004d, 0xff00, 0x5400,
"Maxim Integrated DIMM temperature sensor"
},
/*
* Microchip Technology MCP9805, MCP9843, MCP98242, MCP98243
* and their variants.
* http://ww1.microchip.com/downloads/en/DeviceDoc/21977b.pdf
* Microchip Technology EMC1501.
* http://ww1.microchip.com/downloads/en/DeviceDoc/00001605A.pdf
*/
{
0xffff, 0x0054, 0xff00, 0x0000,
"Microchip DIMM temperature sensor"
},
{
0xffff, 0x0054, 0xff00, 0x2000,
"Microchip DIMM temperature sensor"
},
{
0xffff, 0x0054, 0xff00, 0x2100,
"Microchip DIMM temperature sensor"
},
{
0xffff, 0x1055, 0xff00, 0x0800,
"Microchip DIMM temperature sensor"
},
/*
* NXP Semiconductors SE97 and SE98.
* http://www.nxp.com/docs/en/data-sheet/SE97B.pdf
*/
{
0xffff, 0x1131, 0xff00, 0xa100,
"NXP DIMM temperature sensor"
},
{
0xffff, 0x1131, 0xff00, 0xa200,
"NXP DIMM temperature sensor"
},
/*
* ON Semiconductor CAT34TS02 revisions B and C, CAT6095 and compatible.
* https://www.onsemi.com/pub/Collateral/CAT34TS02-D.PDF
* http://www.onsemi.com/pub/Collateral/CAT6095-D.PDF
*/
{
0xffff, 0x1b09, 0xff00, 0x0800,
"ON Semiconductor DIMM temperature sensor"
},
{
0xffff, 0x1b09, 0xff00, 0x0a00,
"ON Semiconductor DIMM temperature sensor"
},
/*
* ST[Microelectronics] STTS424E02, STTS2002 and others.
* http://www.st.com/resource/en/datasheet/cd00157558.pdf
* http://www.st.com/resource/en/datasheet/stts2002.pdf
*/
{
0xffff, 0x104a, 0xff00, 0x0000,
"ST DIMM temperature sensor"
},
{
0xffff, 0x104a, 0xff00, 0x0300,
"ST DIMM temperature sensor"
},
/* Generic TSE2004av compliant device. */
{
0x0000, 0x0000, 0xff00, 0x2200,
"TSE2004av compliant DIMM temperature sensor"
},
};
static const struct ts_dev *
ts_match_device(uint16_t vid, uint16_t did)
{
const struct ts_dev *d;
int i;
for (i = 0; i < nitems(known_devices); i++) {
d = &known_devices[i];
if ((vid & d->vendor_mask) == d->vendor_id &&
(did & d->device_mask) == d->device_id) {
return (d);
}
}
return (NULL);
}
/*
* SMBus specification defines little-endian byte order, * SMBus specification defines little-endian byte order,
* but it seems that the JEDEC devices expect it to * but it seems that the JEDEC devices expect it to
* be big-endian. * be big-endian.
*/ */
static int static int
ts_readw_be(device_t dev, uint8_t reg, uint16_t *val) ts_readw_be(device_t dev, uint8_t reg, uint16_t *val)
{ {
device_t bus = device_get_parent(dev); device_t bus = device_get_parent(dev);
Show All 31 Linests_temp_sysctl(SYSCTL_HANDLER_ARGS)
temp = temp * 625 + 2731500; temp = temp * 625 + 2731500;
err = sysctl_handle_int(oidp, &temp, 0, req); err = sysctl_handle_int(oidp, &temp, 0, req);
return (err); return (err);
} }
static int static int
ts_probe(device_t dev) ts_probe(device_t dev)
{ {
device_set_desc(dev, "DIMM memory sensor");
return (BUS_PROBE_DEFAULT); return (BUS_PROBE_DEFAULT);
} }
static int static int
ts_attach(device_t dev) ts_attach(device_t dev)
{ {
struct sysctl_ctx_list *ctx; struct sysctl_ctx_list *ctx;
struct sysctl_oid_list *tree; struct sysctl_oid_list *tree;
const struct ts_dev *match;
int err; int err;
uint16_t vendorid; uint16_t vendorid;
uint16_t devid; uint16_t devid;
uint8_t addr; uint8_t addr;
addr = smbus_get_addr(dev); addr = smbus_get_addr(dev);
if ((addr & 0xf0) != 0x30) { if ((addr & 0xf0) != 0x30) {
/* Up to 8 slave devices starting at 0x30. */ /* Up to 8 slave devices starting at 0x30. */
return (ENXIO); return (ENXIO);
} }
err = ts_readw_be(dev, 6, &vendorid); err = ts_readw_be(dev, 6, &vendorid);
if (err != 0) { if (err != 0) {
device_printf(dev, "failed to read Manufacturer ID\n"); device_printf(dev, "failed to read Manufacturer ID\n");
return (ENXIO); return (ENXIO);
} }
err = ts_readw_be(dev, 7, &devid); err = ts_readw_be(dev, 7, &devid);
if (err != 0) { if (err != 0) {
device_printf(dev, "failed to read Device ID\n"); device_printf(dev, "failed to read Device ID\n");
return (ENXIO); return (ENXIO);
} }
if ((devid & 0xff00) == 0x2200) {
/* match = ts_match_device(vendorid, devid);
* Defined by JEDEC Standard No. 21-C, Release 26, if (match == NULL) {
* Page 4.1.6 – 24
*/
} else if (vendorid == 0x104a) {
/*
* STMicroelectronics datasheets say that
* device ID and revision can vary.
* E.g. STT424E02, Doc ID 13448 Rev 8,
* section 4.6, page 26.
*/
} else if (vendorid == 0xb3 && (devid & 0xff00) == 0x2900) {
/*
* IDT TS3000B3A and TSE2002B3C chips and their variants.
* Revision IDs (the lower byte) can vary.
* http://www.idt.com/sites/default/files/documents/IDT_TSE2002B3C_DST_20100512_120303152056.pdf
* http://www.idt.com/sites/default/files/documents/IDT_TS3000B3A_DST_20101129_120303152013.pdf
*/
} else {
if (bootverbose) { if (bootverbose) {
device_printf(dev, "Unknown Manufacturer and Device IDs" device_printf(dev, "Unknown Manufacturer and Device IDs"
", 0x%x and 0x%x\n", vendorid, devid); ", 0x%x and 0x%x\n", vendorid, devid);
} }
return (ENXIO); return (ENXIO);
} }
device_set_desc(dev, match->description);
ctx = device_get_sysctl_ctx(dev); ctx = device_get_sysctl_ctx(dev);
tree = SYSCTL_CHILDREN(device_get_sysctl_tree(dev)); tree = SYSCTL_CHILDREN(device_get_sysctl_tree(dev));
SYSCTL_ADD_PROC(ctx, tree, OID_AUTO, "temp", SYSCTL_ADD_PROC(ctx, tree, OID_AUTO, "temp",
CTLTYPE_INT | CTLFLAG_RD | CTLFLAG_MPSAFE, dev, 0, CTLTYPE_INT | CTLFLAG_RD | CTLFLAG_MPSAFE, dev, 0,
ts_temp_sysctl, "IK4", "Current temperature"); ts_temp_sysctl, "IK4", "Current temperature");
return (0); return (0);
} }
static int static int
Show All 27 Lines
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sysutils/powerdxx/distinfo

Show All 36 Lines
#include <dev/smbus/smbconf.h> #include <dev/smbus/smbconf.h>
#include <dev/smbus/smbus.h> #include <dev/smbus/smbus.h>
#include "smbus_if.h" #include "smbus_if.h"
/* /*
* General device identification notes.
*
* The JEDEC TSE2004av specification defines the device ID that all compliant
* devices should use, but very few do in practice. Maybe that's because
* TSE2002av was rather vague about that.
* Rare examples are IDT TSE2004GB2B0 and Atmel AT30TSE004A, not sure if
* they are TSE2004av compliant by design or by accident.
* Also, the specification mandates that PCI SIG manufacturer IDs are to be
* used, but in practice the JEDEC manufacturer IDs are often used.
*/
rpokalaUnsubmitted
Not Done
Inline Actions

Add a note saying that the spec requires the upper byte of the device_id be 0x22, but that most vendors don't honor that, so that's why we're not checking for it. That makes the 0x22 in the generic case a bit less magic.

rpokala: Add a note saying that the spec requires the upper byte of the device_id be 0x22, but that most…
avgAuthorUnsubmitted
Not Done
Inline Actions

Isn't this comment the comment that you are requesting?

avg: Isn't this comment the comment that you are requesting?
rpokalaUnsubmitted
Not Done
Inline Actions

Err, yes - partly. It mentions that few use the proper one. How about:

... devices should use (high-order byte 0x22), but very few do in practice ...

rpokala: Err, yes - partly. It mentions that few use the proper one. How about: > ... devices should…
avgAuthorUnsubmitted
Not Done
Inline Actions

I think that this comment is fine as is. There is another comment in the code where the magic device ID is actually used.

avg: I think that this comment is fine as is. There is another comment in the code where the magic…
const struct ts_dev {
uint16_t vendor_mask;
impUnsubmitted
Done
Inline Actions

Since the vendor mask is always 0xffff, why have it? It only seems useful for the catch-all at the end...

imp: Since the vendor mask is always 0xffff, why have it? It only seems useful for the catch-all at…
uint16_t vendor_id;
uint16_t device_mask;
impUnsubmitted
Done
Inline Actions

device_mask is likewise always 0xff00. Looks like the lower 8 bits are supposed to be a revision number. I see why you want to mask it, but realistically, will there ever be a time we'd have two different entries here?

imp: device_mask is likewise always 0xff00. Looks like the lower 8 bits are supposed to be a…
rpokalaUnsubmitted
Not Done
Inline Actions

JEDEC Standard No. 21-C
2.24. TSE2004av Device ID / Revision Register
The upper byte of the Device ID / Revision Register must be 0x22 for the TSE2004av. The lower byte holds the revision value which is vendor-specific. This register is not available on EE1004-v devices.

Based on that, we should be looking at all four nybbles, which should be 0x22XX. But as pointed out in the comment, not everyone uses the correct device ID. Since it's the low-order bits which are vendor-specific, shouldn't we only look at those for identification?

(But maybe the vendor datasheets indicate that the low-order bits might be different even for the same part? I haven't looked at them yet; I'll do that later today. If that's the case, then I'd say we shouldn't look at the device-id at all.)

rpokala: > JEDEC Standard No. 21-C > 2.24. TSE2004av Device ID / Revision Register > The upper byte of…
avgAuthorUnsubmitted
Not Done
Inline Actions

The low bits are "volatile". Most vendor specifications say something to the effect that the revision is X in this version of the product and will be incremented in subsequent versions. Anyway, this is mostly moot as of all the devices out there I found only two that have 0x22 in the upper half.

avg: The low bits are "volatile". Most vendor specifications say something to the effect that the…
impUnsubmitted
Not Done
Inline Actions

Right, hence my comment: we should just have a blanket policy of ignoring them and have no need for it in this table.

imp: Right, hence my comment: we should just have a blanket policy of ignoring them and have no need…
avgAuthorUnsubmitted
Not Done
Inline Actions

I removed the generic device ID from the table...
I added it as a special case to ts_match_device though.

avg: I removed the generic device ID from the table... I added it as a special case to…
uint16_t device_id;
const char *description;
} known_devices[] = {
/*
* Analog Devices ADT7408.
* http://www.analog.com/media/en/technical-documentation/data-sheets/ADT7408.pdf
*/
{
0xffff, 0x11d4, 0xff00, 0x0800,
"Analog Devices DIMM temperature sensor"
},
/*
* Atmel AT30TSE002B, AT30TSE004A.
* http://www.atmel.com/images/doc8711.pdf
* http://www.atmel.com/images/atmel-8868-dts-at30tse004a-datasheet.pdf
* Note how one chip uses the JEDEC Manufacturer ID while the other
* uses the PCI SIG one.
*/
{
0xffff, 0x001f, 0xff00, 0x8200,
"Atmel DIMM temperature sensor"
},
{
0xffff, 0x1114, 0xff00, 0x2200,
"Atmel DIMM temperature sensor"
},
/*
* Integrated Device Technology (IDT) TS3000B3A, TSE2002B3C,
* TSE2004GB2B0 chips and their variants.
* http://www.idt.com/sites/default/files/documents/IDT_TSE2002B3C_DST_20100512_120303152056.pdf
* http://www.idt.com/sites/default/files/documents/IDT_TS3000B3A_DST_20101129_120303152013.pdf
* https://www.idt.com/document/dst/tse2004gb2b0-datasheet
*/
{
0xffff, 0x00b3, 0xff00, 0x2900,
"IDT DIMM temperature sensor"
},
{
0xffff, 0x00b3, 0xff00, 0x2200,
"IDT DIMM temperature sensor"
},
/*
* Maxim Integrated MAX6604.
* Different document revisions specify different Device IDs.
* Document 19-3837; Rev 0; 10/05 has 0x3e00 while
* 19-3837; Rev 3; 10/11 has 0x5400.
* http://datasheets.maximintegrated.com/en/ds/MAX6604.pdf
*/
{
0xffff, 0x004d, 0xff00, 0x3e00,
"Maxim Integrated DIMM temperature sensor"
},
{
0xffff, 0x004d, 0xff00, 0x5400,
"Maxim Integrated DIMM temperature sensor"
},
/*
* Microchip Technology MCP9805, MCP9843, MCP98242, MCP98243
* and their variants.
* http://ww1.microchip.com/downloads/en/DeviceDoc/21977b.pdf
* Microchip Technology EMC1501.
* http://ww1.microchip.com/downloads/en/DeviceDoc/00001605A.pdf
*/
{
0xffff, 0x0054, 0xff00, 0x0000,
"Microchip DIMM temperature sensor"
},
{
0xffff, 0x0054, 0xff00, 0x2000,
"Microchip DIMM temperature sensor"
},
{
0xffff, 0x0054, 0xff00, 0x2100,
"Microchip DIMM temperature sensor"
},
{
0xffff, 0x1055, 0xff00, 0x0800,
"Microchip DIMM temperature sensor"
},
/*
* NXP Semiconductors SE97 and SE98.
* http://www.nxp.com/docs/en/data-sheet/SE97B.pdf
*/
{
0xffff, 0x1131, 0xff00, 0xa100,
"NXP DIMM temperature sensor"
},
{
0xffff, 0x1131, 0xff00, 0xa200,
"NXP DIMM temperature sensor"
},
/*
* ON Semiconductor CAT34TS02 revisions B and C, CAT6095 and compatible.
* https://www.onsemi.com/pub/Collateral/CAT34TS02-D.PDF
* http://www.onsemi.com/pub/Collateral/CAT6095-D.PDF
*/
{
0xffff, 0x1b09, 0xff00, 0x0800,
"ON Semiconductor DIMM temperature sensor"
},
{
0xffff, 0x1b09, 0xff00, 0x0a00,
"ON Semiconductor DIMM temperature sensor"
},
/*
* ST[Microelectronics] STTS424E02, STTS2002 and others.
* http://www.st.com/resource/en/datasheet/cd00157558.pdf
* http://www.st.com/resource/en/datasheet/stts2002.pdf
*/
{
0xffff, 0x104a, 0xff00, 0x0000,
"ST DIMM temperature sensor"
},
{
0xffff, 0x104a, 0xff00, 0x0300,
"ST DIMM temperature sensor"
},
/* Generic TSE2004av compliant device. */
{
0x0000, 0x0000, 0xff00, 0x2200,
"TSE2004av compliant DIMM temperature sensor"
},
};
static const struct ts_dev *
ts_match_device(uint16_t vid, uint16_t did)
{
const struct ts_dev *d;
int i;
for (i = 0; i < nitems(known_devices); i++) {
d = &known_devices[i];
if ((vid & d->vendor_mask) == d->vendor_id &&
(did & d->device_mask) == d->device_id) {
return (d);
}
}
return (NULL);
}
/*
* SMBus specification defines little-endian byte order, * SMBus specification defines little-endian byte order,
* but it seems that the JEDEC devices expect it to * but it seems that the JEDEC devices expect it to
* be big-endian. * be big-endian.
*/ */
static int static int
ts_readw_be(device_t dev, uint8_t reg, uint16_t *val) ts_readw_be(device_t dev, uint8_t reg, uint16_t *val)
{ {
device_t bus = device_get_parent(dev); device_t bus = device_get_parent(dev);
Show All 31 Linests_temp_sysctl(SYSCTL_HANDLER_ARGS)
temp = temp * 625 + 2731500; temp = temp * 625 + 2731500;
err = sysctl_handle_int(oidp, &temp, 0, req); err = sysctl_handle_int(oidp, &temp, 0, req);
return (err); return (err);
} }
static int static int
ts_probe(device_t dev) ts_probe(device_t dev)
{ {
device_set_desc(dev, "DIMM memory sensor");
return (BUS_PROBE_DEFAULT); return (BUS_PROBE_DEFAULT);
} }
static int static int
ts_attach(device_t dev) ts_attach(device_t dev)
{ {
struct sysctl_ctx_list *ctx; struct sysctl_ctx_list *ctx;
struct sysctl_oid_list *tree; struct sysctl_oid_list *tree;
const struct ts_dev *match;
int err; int err;
uint16_t vendorid; uint16_t vendorid;
uint16_t devid; uint16_t devid;
uint8_t addr; uint8_t addr;
addr = smbus_get_addr(dev); addr = smbus_get_addr(dev);
if ((addr & 0xf0) != 0x30) { if ((addr & 0xf0) != 0x30) {
/* Up to 8 slave devices starting at 0x30. */ /* Up to 8 slave devices starting at 0x30. */
return (ENXIO); return (ENXIO);
} }
err = ts_readw_be(dev, 6, &vendorid); err = ts_readw_be(dev, 6, &vendorid);
if (err != 0) { if (err != 0) {
device_printf(dev, "failed to read Manufacturer ID\n"); device_printf(dev, "failed to read Manufacturer ID\n");
return (ENXIO); return (ENXIO);
} }
err = ts_readw_be(dev, 7, &devid); err = ts_readw_be(dev, 7, &devid);
if (err != 0) { if (err != 0) {
device_printf(dev, "failed to read Device ID\n"); device_printf(dev, "failed to read Device ID\n");
return (ENXIO); return (ENXIO);
} }
if ((devid & 0xff00) == 0x2200) {
/* match = ts_match_device(vendorid, devid);
* Defined by JEDEC Standard No. 21-C, Release 26, if (match == NULL) {
* Page 4.1.6 – 24
*/
} else if (vendorid == 0x104a) {
/*
* STMicroelectronics datasheets say that
* device ID and revision can vary.
* E.g. STT424E02, Doc ID 13448 Rev 8,
* section 4.6, page 26.
*/
} else if (vendorid == 0xb3 && (devid & 0xff00) == 0x2900) {
/*
* IDT TS3000B3A and TSE2002B3C chips and their variants.
* Revision IDs (the lower byte) can vary.
* http://www.idt.com/sites/default/files/documents/IDT_TSE2002B3C_DST_20100512_120303152056.pdf
* http://www.idt.com/sites/default/files/documents/IDT_TS3000B3A_DST_20101129_120303152013.pdf
*/
} else {
if (bootverbose) { if (bootverbose) {
device_printf(dev, "Unknown Manufacturer and Device IDs" device_printf(dev, "Unknown Manufacturer and Device IDs"
", 0x%x and 0x%x\n", vendorid, devid); ", 0x%x and 0x%x\n", vendorid, devid);
} }
return (ENXIO); return (ENXIO);
} }
device_set_desc(dev, match->description);
ctx = device_get_sysctl_ctx(dev); ctx = device_get_sysctl_ctx(dev);
tree = SYSCTL_CHILDREN(device_get_sysctl_tree(dev)); tree = SYSCTL_CHILDREN(device_get_sysctl_tree(dev));
SYSCTL_ADD_PROC(ctx, tree, OID_AUTO, "temp", SYSCTL_ADD_PROC(ctx, tree, OID_AUTO, "temp",
CTLTYPE_INT | CTLFLAG_RD | CTLFLAG_MPSAFE, dev, 0, CTLTYPE_INT | CTLFLAG_RD | CTLFLAG_MPSAFE, dev, 0,
ts_temp_sysctl, "IK4", "Current temperature"); ts_temp_sysctl, "IK4", "Current temperature");
return (0); return (0);
} }
static int static int
Show All 27 Lines
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sysutils/powerdxx/pkg-plist

Show All 36 Lines
#include <dev/smbus/smbconf.h> #include <dev/smbus/smbconf.h>
#include <dev/smbus/smbus.h> #include <dev/smbus/smbus.h>
#include "smbus_if.h" #include "smbus_if.h"
/* /*
* General device identification notes.
*
* The JEDEC TSE2004av specification defines the device ID that all compliant
* devices should use, but very few do in practice. Maybe that's because
* TSE2002av was rather vague about that.
* Rare examples are IDT TSE2004GB2B0 and Atmel AT30TSE004A, not sure if
* they are TSE2004av compliant by design or by accident.
* Also, the specification mandates that PCI SIG manufacturer IDs are to be
* used, but in practice the JEDEC manufacturer IDs are often used.
*/
rpokalaUnsubmitted
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Add a note saying that the spec requires the upper byte of the device_id be 0x22, but that most vendors don't honor that, so that's why we're not checking for it. That makes the 0x22 in the generic case a bit less magic.

rpokala: Add a note saying that the spec requires the upper byte of the device_id be 0x22, but that most…
avgAuthorUnsubmitted
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Isn't this comment the comment that you are requesting?

avg: Isn't this comment the comment that you are requesting?
rpokalaUnsubmitted
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Err, yes - partly. It mentions that few use the proper one. How about:

... devices should use (high-order byte 0x22), but very few do in practice ...

rpokala: Err, yes - partly. It mentions that few use the proper one. How about: > ... devices should…
avgAuthorUnsubmitted
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I think that this comment is fine as is. There is another comment in the code where the magic device ID is actually used.

avg: I think that this comment is fine as is. There is another comment in the code where the magic…
const struct ts_dev {
uint16_t vendor_mask;
impUnsubmitted
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Since the vendor mask is always 0xffff, why have it? It only seems useful for the catch-all at the end...

imp: Since the vendor mask is always 0xffff, why have it? It only seems useful for the catch-all at…
uint16_t vendor_id;
uint16_t device_mask;
impUnsubmitted
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device_mask is likewise always 0xff00. Looks like the lower 8 bits are supposed to be a revision number. I see why you want to mask it, but realistically, will there ever be a time we'd have two different entries here?

imp: device_mask is likewise always 0xff00. Looks like the lower 8 bits are supposed to be a…
rpokalaUnsubmitted
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JEDEC Standard No. 21-C
2.24. TSE2004av Device ID / Revision Register
The upper byte of the Device ID / Revision Register must be 0x22 for the TSE2004av. The lower byte holds the revision value which is vendor-specific. This register is not available on EE1004-v devices.

Based on that, we should be looking at all four nybbles, which should be 0x22XX. But as pointed out in the comment, not everyone uses the correct device ID. Since it's the low-order bits which are vendor-specific, shouldn't we only look at those for identification?

(But maybe the vendor datasheets indicate that the low-order bits might be different even for the same part? I haven't looked at them yet; I'll do that later today. If that's the case, then I'd say we shouldn't look at the device-id at all.)

rpokala: > JEDEC Standard No. 21-C > 2.24. TSE2004av Device ID / Revision Register > The upper byte of…
avgAuthorUnsubmitted
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The low bits are "volatile". Most vendor specifications say something to the effect that the revision is X in this version of the product and will be incremented in subsequent versions. Anyway, this is mostly moot as of all the devices out there I found only two that have 0x22 in the upper half.

avg: The low bits are "volatile". Most vendor specifications say something to the effect that the…
impUnsubmitted
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Right, hence my comment: we should just have a blanket policy of ignoring them and have no need for it in this table.

imp: Right, hence my comment: we should just have a blanket policy of ignoring them and have no need…
avgAuthorUnsubmitted
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I removed the generic device ID from the table...
I added it as a special case to ts_match_device though.

avg: I removed the generic device ID from the table... I added it as a special case to…
uint16_t device_id;
const char *description;
} known_devices[] = {
/*
* Analog Devices ADT7408.
* http://www.analog.com/media/en/technical-documentation/data-sheets/ADT7408.pdf
*/
{
0xffff, 0x11d4, 0xff00, 0x0800,
"Analog Devices DIMM temperature sensor"
},
/*
* Atmel AT30TSE002B, AT30TSE004A.
* http://www.atmel.com/images/doc8711.pdf
* http://www.atmel.com/images/atmel-8868-dts-at30tse004a-datasheet.pdf
* Note how one chip uses the JEDEC Manufacturer ID while the other
* uses the PCI SIG one.
*/
{
0xffff, 0x001f, 0xff00, 0x8200,
"Atmel DIMM temperature sensor"
},
{
0xffff, 0x1114, 0xff00, 0x2200,
"Atmel DIMM temperature sensor"
},
/*
* Integrated Device Technology (IDT) TS3000B3A, TSE2002B3C,
* TSE2004GB2B0 chips and their variants.
* http://www.idt.com/sites/default/files/documents/IDT_TSE2002B3C_DST_20100512_120303152056.pdf
* http://www.idt.com/sites/default/files/documents/IDT_TS3000B3A_DST_20101129_120303152013.pdf
* https://www.idt.com/document/dst/tse2004gb2b0-datasheet
*/
{
0xffff, 0x00b3, 0xff00, 0x2900,
"IDT DIMM temperature sensor"
},
{
0xffff, 0x00b3, 0xff00, 0x2200,
"IDT DIMM temperature sensor"
},
/*
* Maxim Integrated MAX6604.
* Different document revisions specify different Device IDs.
* Document 19-3837; Rev 0; 10/05 has 0x3e00 while
* 19-3837; Rev 3; 10/11 has 0x5400.
* http://datasheets.maximintegrated.com/en/ds/MAX6604.pdf
*/
{
0xffff, 0x004d, 0xff00, 0x3e00,
"Maxim Integrated DIMM temperature sensor"
},
{
0xffff, 0x004d, 0xff00, 0x5400,
"Maxim Integrated DIMM temperature sensor"
},
/*
* Microchip Technology MCP9805, MCP9843, MCP98242, MCP98243
* and their variants.
* http://ww1.microchip.com/downloads/en/DeviceDoc/21977b.pdf
* Microchip Technology EMC1501.
* http://ww1.microchip.com/downloads/en/DeviceDoc/00001605A.pdf
*/
{
0xffff, 0x0054, 0xff00, 0x0000,
"Microchip DIMM temperature sensor"
},
{
0xffff, 0x0054, 0xff00, 0x2000,
"Microchip DIMM temperature sensor"
},
{
0xffff, 0x0054, 0xff00, 0x2100,
"Microchip DIMM temperature sensor"
},
{
0xffff, 0x1055, 0xff00, 0x0800,
"Microchip DIMM temperature sensor"
},
/*
* NXP Semiconductors SE97 and SE98.
* http://www.nxp.com/docs/en/data-sheet/SE97B.pdf
*/
{
0xffff, 0x1131, 0xff00, 0xa100,
"NXP DIMM temperature sensor"
},
{
0xffff, 0x1131, 0xff00, 0xa200,
"NXP DIMM temperature sensor"
},
/*
* ON Semiconductor CAT34TS02 revisions B and C, CAT6095 and compatible.
* https://www.onsemi.com/pub/Collateral/CAT34TS02-D.PDF
* http://www.onsemi.com/pub/Collateral/CAT6095-D.PDF
*/
{
0xffff, 0x1b09, 0xff00, 0x0800,
"ON Semiconductor DIMM temperature sensor"
},
{
0xffff, 0x1b09, 0xff00, 0x0a00,
"ON Semiconductor DIMM temperature sensor"
},
/*
* ST[Microelectronics] STTS424E02, STTS2002 and others.
* http://www.st.com/resource/en/datasheet/cd00157558.pdf
* http://www.st.com/resource/en/datasheet/stts2002.pdf
*/
{
0xffff, 0x104a, 0xff00, 0x0000,
"ST DIMM temperature sensor"
},
{
0xffff, 0x104a, 0xff00, 0x0300,
"ST DIMM temperature sensor"
},
/* Generic TSE2004av compliant device. */
{
0x0000, 0x0000, 0xff00, 0x2200,
"TSE2004av compliant DIMM temperature sensor"
},
};
static const struct ts_dev *
ts_match_device(uint16_t vid, uint16_t did)
{
const struct ts_dev *d;
int i;
for (i = 0; i < nitems(known_devices); i++) {
d = &known_devices[i];
if ((vid & d->vendor_mask) == d->vendor_id &&
(did & d->device_mask) == d->device_id) {
return (d);
}
}
return (NULL);
}
/*
* SMBus specification defines little-endian byte order, * SMBus specification defines little-endian byte order,
* but it seems that the JEDEC devices expect it to * but it seems that the JEDEC devices expect it to
* be big-endian. * be big-endian.
*/ */
static int static int
ts_readw_be(device_t dev, uint8_t reg, uint16_t *val) ts_readw_be(device_t dev, uint8_t reg, uint16_t *val)
{ {
device_t bus = device_get_parent(dev); device_t bus = device_get_parent(dev);
Show All 31 Linests_temp_sysctl(SYSCTL_HANDLER_ARGS)
temp = temp * 625 + 2731500; temp = temp * 625 + 2731500;
err = sysctl_handle_int(oidp, &temp, 0, req); err = sysctl_handle_int(oidp, &temp, 0, req);
return (err); return (err);
} }
static int static int
ts_probe(device_t dev) ts_probe(device_t dev)
{ {
device_set_desc(dev, "DIMM memory sensor");
return (BUS_PROBE_DEFAULT); return (BUS_PROBE_DEFAULT);
} }
static int static int
ts_attach(device_t dev) ts_attach(device_t dev)
{ {
struct sysctl_ctx_list *ctx; struct sysctl_ctx_list *ctx;
struct sysctl_oid_list *tree; struct sysctl_oid_list *tree;
const struct ts_dev *match;
int err; int err;
uint16_t vendorid; uint16_t vendorid;
uint16_t devid; uint16_t devid;
uint8_t addr; uint8_t addr;
addr = smbus_get_addr(dev); addr = smbus_get_addr(dev);
if ((addr & 0xf0) != 0x30) { if ((addr & 0xf0) != 0x30) {
/* Up to 8 slave devices starting at 0x30. */ /* Up to 8 slave devices starting at 0x30. */
return (ENXIO); return (ENXIO);
} }
err = ts_readw_be(dev, 6, &vendorid); err = ts_readw_be(dev, 6, &vendorid);
if (err != 0) { if (err != 0) {
device_printf(dev, "failed to read Manufacturer ID\n"); device_printf(dev, "failed to read Manufacturer ID\n");
return (ENXIO); return (ENXIO);
} }
err = ts_readw_be(dev, 7, &devid); err = ts_readw_be(dev, 7, &devid);
if (err != 0) { if (err != 0) {
device_printf(dev, "failed to read Device ID\n"); device_printf(dev, "failed to read Device ID\n");
return (ENXIO); return (ENXIO);
} }
if ((devid & 0xff00) == 0x2200) {
/* match = ts_match_device(vendorid, devid);
* Defined by JEDEC Standard No. 21-C, Release 26, if (match == NULL) {
* Page 4.1.6 – 24
*/
} else if (vendorid == 0x104a) {
/*
* STMicroelectronics datasheets say that
* device ID and revision can vary.
* E.g. STT424E02, Doc ID 13448 Rev 8,
* section 4.6, page 26.
*/
} else if (vendorid == 0xb3 && (devid & 0xff00) == 0x2900) {
/*
* IDT TS3000B3A and TSE2002B3C chips and their variants.
* Revision IDs (the lower byte) can vary.
* http://www.idt.com/sites/default/files/documents/IDT_TSE2002B3C_DST_20100512_120303152056.pdf
* http://www.idt.com/sites/default/files/documents/IDT_TS3000B3A_DST_20101129_120303152013.pdf
*/
} else {
if (bootverbose) { if (bootverbose) {
device_printf(dev, "Unknown Manufacturer and Device IDs" device_printf(dev, "Unknown Manufacturer and Device IDs"
", 0x%x and 0x%x\n", vendorid, devid); ", 0x%x and 0x%x\n", vendorid, devid);
} }
return (ENXIO); return (ENXIO);
} }
device_set_desc(dev, match->description);
ctx = device_get_sysctl_ctx(dev); ctx = device_get_sysctl_ctx(dev);
tree = SYSCTL_CHILDREN(device_get_sysctl_tree(dev)); tree = SYSCTL_CHILDREN(device_get_sysctl_tree(dev));
SYSCTL_ADD_PROC(ctx, tree, OID_AUTO, "temp", SYSCTL_ADD_PROC(ctx, tree, OID_AUTO, "temp",
CTLTYPE_INT | CTLFLAG_RD | CTLFLAG_MPSAFE, dev, 0, CTLTYPE_INT | CTLFLAG_RD | CTLFLAG_MPSAFE, dev, 0,
ts_temp_sysctl, "IK4", "Current temperature"); ts_temp_sysctl, "IK4", "Current temperature");
return (0); return (0);
} }
static int static int
Show All 27 Lines